This video explains the key features of the PFH500F series, TDK-Lambda’s next generation of conduction-cooled AC-DC power modules. The series features a reduced package size and higher efficiency through the use of GaN semiconductors, bridgeless power factor correction and digital control. Digital isolators have replaced traditional optocouplers for long term stability and reliability.
The package size is 4″ x 2.4″, a 27% reduction over the previous PFE500F series and has a power density of 102W per cubic inch. The metal case of the module assists with heat dissipation and reduces radiated EMI. The series is safety certificated to IEC 62368-1.
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