{"id":2569,"date":"2015-01-21T12:00:48","date_gmt":"2015-01-21T12:00:48","guid":{"rendered":"http:\/\/blog.uk.tdk-lambda.com\/uk\/?p=2569"},"modified":"2015-07-10T11:07:44","modified_gmt":"2015-07-10T11:07:44","slug":"new-power-supply-heatsink-construction-patent","status":"publish","type":"post","link":"https:\/\/blog.uk.tdk-lambda.com\/uk\/2015\/01\/21\/new-power-supply-heatsink-construction-patent\/","title":{"rendered":"New Power Supply Heatsink Construction Patent"},"content":{"rendered":"

TDK Corporation announces that TDK-Lambda UK\u2019s power supply heat-sink arrangement patent application has been approved by the UK Intellectual Property Office.<\/p>\n

Power supplies designers utilise a variety of components that dissipate heat, including leaded (through hole) and surface mount devices. These parts, however, require different cooling arrangements.<\/p>\n

Surface mount power devices can be mounted on an insulated metal substrate (IMS) consisting of layers of copper traces and thermally conductive insulation bonded to a metal baseplate. This substrate is usually vertically mounted and electrically connected to the main circuit board with a lead-frame.<\/p>\n

Although power semiconductors are available in surface mount packages, it is easier to transfer high currents to the main board with a leaded part. This alleviates the need for multiple low current pins on the lead-frame, occupying valuable board area. Conversely leaded parts require fasteners and insulation to mount them to a heatsink. Surface mount I2PAK packages with leads to carry the high currents to the main board are available, but are expensive. Consequently, a combination of both surface mount and leaded components are generally required.<\/p>\n

\"\"<\/a><\/p>\n

\u201cAvailable space and electrical clearance was an issue,\u201d Martin Coates Senior Electrical Design Engineer, TDK-Lambda explained. \u201cWe needed a cost effective hybrid solution.\u201d<\/p>\n

The heat-sink arrangement developed by TDK-Lambda utilises a traditional IMS board
\ncontaining surface mounted power components on one side. Leaded power semiconductors are attached to the other side with a double-sided adhesive tape with both insulating and thermally conductive properties. The completed space saving assembly does not use any mechanical fasteners and can be easily soldered to the main circuit board.<\/p>\n

For more information about TDK-Lambda\u2019s AC-DC power supplies, please call TDK-Lambda directly on +44 (0)1271 856600 or visit the TDK-Lambda website at: www.emea.lambda.tdk.com\/uk<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"

TDK Corporation announces that TDK-Lambda UK\u2019s power supply heat-sink arrangement patent application has been approved by the UK Intellectual Property Office. Power supplies designers utilise a variety of components that dissipate heat, including leaded (through hole) and surface mount devices. These parts, however, require different cooling arrangements. Surface mount power devices can be mounted on […]<\/p>\n","protected":false},"author":11,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[17],"tags":[],"class_list":["post-2569","post","type-post","status-publish","format-standard","hentry","category-news"],"acf":[],"yoast_head":"\nNew Power Supply Heatsink Construction Patent « TDK-Lambda UK Blog<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/blog.uk.tdk-lambda.com\/uk\/2015\/01\/21\/new-power-supply-heatsink-construction-patent\/\" \/>\n<meta property=\"og:locale\" content=\"en_GB\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"New Power Supply Heatsink Construction Patent « TDK-Lambda UK Blog\" \/>\n<meta property=\"og:description\" content=\"TDK Corporation announces that TDK-Lambda UK\u2019s power supply heat-sink arrangement patent application has been approved by the UK Intellectual Property Office. Power supplies designers utilise a variety of components that dissipate heat, including leaded (through hole) and surface mount devices. These parts, however, require different cooling arrangements. Surface mount power devices can be mounted on […]\" \/>\n<meta property=\"og:url\" content=\"https:\/\/blog.uk.tdk-lambda.com\/uk\/2015\/01\/21\/new-power-supply-heatsink-construction-patent\/\" \/>\n<meta property=\"og:site_name\" content=\"TDK-Lambda UK Blog\" \/>\n<meta property=\"article:published_time\" content=\"2015-01-21T12:00:48+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2015-07-10T11:07:44+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/blog.uk.tdk-lambda.com\/uk\/files\/2015\/01\/Martin-Coates-Senior-Electrical-Design-Engineer-TDK-Lambda-204x300.jpg\" \/>\n<meta name=\"author\" content=\"Dulcie\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Dulcie\" \/>\n\t<meta name=\"twitter:label2\" content=\"Estimated reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" 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